Polished Wafer
Polished Wafer is a thin disc-shaped single crystal silicon substrate manufactured from high-purity poly-crystalline silicon
by series of melting, crystal growth, cutting, polishing and washing processes.
It is the most common wafer used to manufacture semiconductor chips.
Diameter: 100~150mm
| Specification | 100 mm | 125 mm | 150 mm | |
|---|---|---|---|---|
| Type [Dopant] | P | Boron | ||
| N | Phosphorus [P], Red-Phosphorus, Antimony [Sb], Arsenic [As] | |||
| Resistivity (Ω·cm) | P | 0.001~100 | ||
| N | 0.001~100 | |||
| Thickness (μm) | 525±25 | 575±25 | 625±25 | |
| 675±25 | ||||
| Warp (μm) | Max 30 | |||
| TTV (μm) | Max 30 | |||
♦ Available in customized specs for specific needs.
ex) 150mm, N[As], Thickness-375±10μm
Diameter: 200~300mm
| Specification | 200 mm | 300 mm | |
|---|---|---|---|
| Type [Dopant] | P | Boron | |
| N | Phosphorus [P], Antimony [Sb], Arsenic [As] | ||
| Resistivity (Ω·cm) | P | 0.001~100 | |
| N | |||
| Thickness (μm) | 725±25 | 775±25 | |
| Warp (μm) | Max 50 | Max 30 | |
| TTV (μm) | Max 30 | Max 5 | |
♦ Additional product line-ups are ready upon customer’s request.
ex) Particle, Resistivity, Flat or Notch etc.